Tray Assembly Daily Schedule

Date HDI Detector
9/15
Wed
T015T, T016B, T014T:
    Bend down (MH) & E-test (SS)
T015B, T016T:
    Glue H23, H17 (GP)
T007T/B, T008T/B:
    Wire Bond (JC) & IV (SS)
T017B, T014T:
    Glue Detectors (MH)
L132-L139:
    Measure postpot IV (SS)
9/16
Thu
T015B, T016T, T018T:
    Wire Bond (JC), E-test (SS), & Pot (MH)
T013B, T014B:
    Glue Detectors (MH)
9/17
Fri
T015B, T016T, T018T:
    Bend down (MH) & E-test (SS)
T020T:
    Prep. and glue H26 (GP)
T017T/B, T019T/B:
    Wire Bond (JC) & IV (SS)
T016T, T018T:
    Glue Detectors (MH)
9/20
Mon
T020T:
    Wire Bond, E-test, & Pot (MH)
T013T/B:
    Wire Bond (GP) & IV (MH)
T016B, T018B:
    Glue Detectors (MH)
9/21
Tue
T020T:
    Bend down & E-test (MH)
T014T/B, T016T/B:
    Wire Bond (GP) & IV (MH)
T015B, T020T:
    Glue Detector (MH)
9/22
Wed
None T018T/B, T020T:
    Wire Bond (GP) & IV (MH)
TBD (T009T/B, T015T, T003B):
    Glue Detector (MH)
9/23
Thu
None TBD (T009T/B, T015T, T003B):
    Glue Detector (MH)
TBD (T009T/B, T015T/B, T003T/B):
    Wire Bond (GP) & IV (MH)
9/24
Fri
None TBD (T009T/B, T015T/B, T003T/B):
    Wire Bond (GP) & IV (MH)

Last modified: Tue Sep 14 19:56:45 PDT 1999