Disassembly Procedure

1. Move tower to clean room and transfer to surface plate DONE 10/11/00
2. Test tension on Vectan cables DONE 10/1/00
3. Remove Kapton cables DONE 10/11/00
4. Remove side walls DONE 10/11/00
5. Label all side walls, cables, repeater boards. DONE 10/19/00
6. Inspect trays, spacers, and alignment: check tray with bad Z align.
7. Put handles and HDI covers on all trays
8. Finalize plan to support fallen ladders
9. Remove Vectran cables
10. Thread piano wire through corners
11. Remove first tray
• Put on top cover
• Mount Alec's tray jack(s)
• Lift tray by turning screws
• Make sure alignment pins and spacer sit on lower tray
• Remove tray, flip over, test detectors with vacuum tool, place bottom cover
12. Remove Second tray
• Test ladders with calibrated vacuum tool
• Put top cover on tray
• Lower piano wire to just above spacer and pins
• Carefully remove pins and spacer
• Mount Alec's tray jack(s)
• Lift tray by turning screws
• Make sure alignment pins and spacer sit on lower tray
• Remove tray, flip over, test detectors with vacuum tool, place bottom cover
13. Repeat for the rest of the trays with careful attention being paid to trays with fallen ladders.

Things that need to be repaired

1. Fallen ladders need to be silver glued and aligned
• support ladder with jig
• thread plastic dispensing needle to detector intersections
• dispense 1” bead of glue in 2 locations near each edge
• repeat for all intersections
• place glue on bias pads for last detector bye eye
• put small weights on ladder and align by eye
2. All other ladders need to be tacked
• Use Epo-Tek 301-2 (ladder encapsulation)
• Dispense known volume along end of ladder opposite electronics
• Dispense small volume between detectors, where wire bonds are
3. Check for broken kapton cable/connector.
4. There is one inefficent ladder. Maybe it is not glued properly.
5. There will be less then 8 hdi's on some kapton cables and therefore the data lines have to be terminated. Use a termination board, If we don't have enough connectors just glue the cable to the board and solder the four pins that are needed (It might be easier to take of the connector).

Test Setup Procedure

1. Each tray will be tested using the Logic analyzer and the same program that has been used for the BTEM production.
2. The interface board that was used for the chip testing will be used.
3. The detector should be biased and an IV-curve should be taken. A dark box is needed.
4. The inspection station PC will be temporarily used to controll the logic analyzer. A gpib-card will be installed.
5. Repair and testing is done in parallel.
6. After the ladders are tacked (and repaired if nessesary) a tray is tested. If it passes the tested they are stored until the BFEM is assembled.

Before moving the tower

1. find bad read out cables and the reason/symptoms.