Minutes glast lab meeting October 3.

Hartmut, Gwelen, Robert, Sergei, Masa, Wilko


HDI:

Sergei is ordered the footprint layout for the passive components of the hdi.
Bill ordered poding components for the chips of the hdi. It should arrive
in a few days. This component will be used for encapsulting the chips but
not the passive components. For the encapsulation of the passive components
Parylene is an interesting alternative. It is vaccuum deposited so the hdi
has to be sent to a company. Another possibility is to use the same silicone
material that has been used for the BTEM. 

Gwelen showed a glue dispensing tool that has a travel of 18 x 18 inch**2. A used
one cost less then $10K. 

We have still two unused hdi's that are not working properly. We will try to
fix them and use one of them for the encapsulation tests. This hybrid
will be temperature cycled with and without beeing encapsulated.

BTEM:
We have almost all the components to disassemble the tracker. Sliver glue
was ordered today, so it should be here next weeks. Alec wasn't at the meeting
so we don't know if the ladder holding pieces are done yet. If we have everything
we will start disassembling the tower next week. The repair and reassemble should
take 2-3 weeks.

Daq:
The new NI VME interface card for Linux arrived and is installed. The daq software
has to be ported from VxWorks to the PC. 

Command decoder chip:
Wilko reported that Mat tested the command decoder test chip. A pico-probe was used to
probe the outputs. The chip works at clock cycles of 10 mus and larger but stops
working at < 5 mus. It is not a problem of the chip but of the output drivers.
We also observed that the reset-fifo and reset-chip output signals work only if
the chip is illuminated with light.








Action items:

Wilko,Gwelen: procedure to disassemble and repair the tower. Make sure all pieces
	      that are needed are available.