GLAST Lab Meeting minutes for 8/8/00

Wilko- PC DAQ system is working, but needs more work to do threshold
scans, etc.  Masa will 
start taking measurements with the system.  Components are loaded on a
single chip board for 
Pisa. Now we just need a chip and wire bonding. 

There may not be time to take apart the tower before the Italians leave.
We need to keep the 
tower intact until  noise measurements have been done.

Bill has ordered new Urelane which has arrived.  He will test it
immediately to avoid letting it get 
out of date again.  Bill will ask EH&S if there is a fume hood in the room
next to the clean room 
that we could take ownership of.

Alec demonstrated a mock up of tools to remove trays from the tower in a
totally controlled way.  
Some extra pieces would be, clips for falling detectors, piano wire to
hold pins and spacers.  We 
decided to disassembly the tower in the clean room which need some
cleaning before we start.

Kamal said that his temperature measurement is ADC resolution limited.
This gives us approx. 
0.5 C resolution.  

Gwelen wants to order another ADC for the environmental chamber that has
more resolution and 
is designed more for temp. and strain measurement (low speed).  (PO has
been put in).

Masa said that if we do cap testing of STM detectors that we will do it by
hand since it is too hard 
to setup the automatic probe station.  The measurement could be done
semi-automatically on the 
probe station with only one computer.  Masa and Bill are in the process of
trying to get 
Wentworth to upgrade the probe station software to NT.

Alec has made a G10 substrate for the next RAI (right angle
intereconnect).  He also checked to 
see if the plexiglass base piece we had would survive solder reflow oven
temperatures.  Not 
surprisingly, it won't.  He put it in an oven at 170 C for 20 min. and the
Kapton peeled off.  
Robert reminded us that the plan was to load the passives, test, and then
assembly the RAI 
anyway.  Alec mentioned again the possibility of pre-bending the Kapton.

Gwelen and Mat are working on a test plan for testing the degredation the
conductivity of 
conductive adhesives under thermo-cyling.  They have found some references
to studies which 
may be helpful.