Summary of tray assembly discussion between Pisa and SCIPP.

1.  Sandro said that the wire bonding surface of the MCM (top of the
Right Angle Interconnect) needs to have less than  a 200 micron step to
the top of the bias circuit.  The solution is to design the RAI to end
100 microns below the top of the bias on the bottom of the tray
(converter).  This subsequently puts the RAI 100 microns above the bias
circuit on the top of the tray.  Then we need to hold a manufacturing
and assembly tolerance stackup within +-100 microns for the MCM.  Gwelen
believes this is achievable.

2.  There was a lot of discussion of the possible benefits of having a
connector other than Nanonics on the other end of the connector savers.
Benefits are possible cost savings on connector savers, more easy
connection during testing, more flexibility of test setups.  Advantages
of keeping Nanonics on both ends of the connector saver is that flight
style cables can be used for testing.  Tom said he would ask Nanonics
for a quote on connector savers with a cheaper connector on the other
end to see if there is really any cost savings.  The general consensus
was that Nanonics connectors on both ends is the solution.

3.  Tooling design and assembly procedures were discussed and a lot of
ideas were shared.