Tasks of the Test
Assembly
- test glueing of cut-out to silicon surface with epoxy
- immerse PG cut-out in epoxy to generate coating
- glue carbon-carbon to ear to strengthen it
- temperature cycle glued pieces (-20° to +50° C)
- clean surface with ultrasonic cleaner and alcohol or rub them with Q-tip and alcohol until clean
Temperature Measurement:
- understand RTD use with LCR-meter, Keithley power supply or HP4145
- measure at -20 °, +20 ° and +50° to find slope
- measure all RTD's without power at -20 °, +20 ° and +50°
- allowed signal: P < 1 mW, R = 100 ohm
- required voltage V < sqrt(P*R) = sqrt(0.1) = 0.3 V
- use 50 mV: P = (0.05V)²/100 ohm = 25 µW
Heating of new Hamamatsu Detector
- connect every 10. strip to voltage
- "forward" bias relative to backplane
- needs 100 bonds?
Design of the M-Module
Preliminary Results of Thermal Test
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